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MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning

1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor2. Bright solder joints, no resistance, non-conductive3. Less residue, less smoke, good flow performance4....

  • $15.87
  • $12.70

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  • Product Category: other
  • Availability: In stock

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1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
2. Bright solder joints, no resistance, non-conductive
3. Less residue, less smoke, good flow performance
4. No short circuit, no need to clean, infinite conductivity
5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
6. Weight: about 20g
7. Size: about 12.7 x 2.9cm

Specification:

Package Weight
One Package Weight 0.03kgs / 0.07lb
One Package Size 15cm * 5cm * 5cm / 5.91inch * 1.97inch * 1.97inch
Qty per Carton 210
Carton Weight 7.40kgs / 16.31lb
Carton Size 50cm * 38cm * 32cm / 19.69inch * 14.96inch * 12.6inch
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