1. Adopts closed loop of transducer with Mcu intelligent drive, digital LED display. Fast and stable heating up, good for lead free work.
2. The air flow can be adjustable, and air blowing is low noise and gentle, plastic components won’t be deformed.
3. Suitable for removing SOIC, PLCC, chip, QFP and BGA
4. 3 air gun nozzles available, easy to replace
5. Air Temperature Range: 150-500 Celsius degree
6. Soldering Iron Temperature Range: 200-480 Celsius degree
7. Amount of Wind: 120L/min(MAX)
8. Noises: <45db

Specification:

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